Integrated manufacturing of REciclable multi-material COmposites for the TRANSport sector

Landfill leachate is a complex wastewater with high concentration and toxicity that poses a serious threat to public health and the environment by contaminating groundwater. Although natural attenuation processes occur within the aquifer, the temporal changes in geochemical parameters and microbial community structure within the pollution plume are not well understood. This study features microcosm simulation experiments conducted using a range of dilution ratios intended to simulate different locations within a landfill leachate pollution plume. The study monitored changes in biogeochemical parameters at different positions of the pollution plume during natural attenuation. The results show that the pollution source of landfill leachate leakage contamination is characterized by high electrical conductivity (EC) and low oxidation–reduction potential (ORP). Biogeochemical parameters within the plume changed significantly, with oxygen being rapidly consumed to form an anaerobic environment that entered an initial stage of acid production followed by methane production. The pH decreased during the acid-producing stage, but then increased during the methanogenic stage, with a concurrent decrease in total organic carbon (TOC) content. In addition, 16S rRNA amplicon sequencing revealed that in areas closer to the pollution source, the bacterial diversity index was lower and the relative abundance of Prolixibacteraceae and Trueperaceae as well as microorganisms capable of anaerobic fermentation, degradation, and heavy metal resistance was higher. Spearman correlation analysis of geochemical parameters and microbial functional genes demonstrated that an environment characterized by low dissolved oxygen (DO) and ORP within the plume could enhance the abundance of microbial functional genes associated with transport and catabolism, energy metabolism, nucleotide metabolism, replication and repair, and membrane transport. Graphical

» More Information

« Go to Technological Watch